Heat-seal connectors are typically specified by the number of lines (pins), pitch (center-to-center spacing), and length; for example, "1018/210" indicates 10 pins, a pitch of 1.8 mm, and a length of 210 mm, with a minimum line spacing capability of 0.2 mm. Regarding electrical properties, the conductive resistance is less than 20 Ω/square (at 25°C), and the insulation resistance exceeds 100 MΩ (at 25°C). Standard application conditions include a heat-sealing temperature of 130°C–200°C, a bonding time of 3–5 seconds, and a pressure of 1.0–2.0 bar. In terms of adhesion, the peel strength exceeds 450 gf/cm. The operating temperature range is -35°C to 70°C, and the shelf life exceeds one year.
The standard application process is as follows: first, remove the release liner from the back of the heat-seal connector; next, align the connector's electrodes with the corresponding electrodes on the PCB and LCD; finally, bond the components using a specialized high-temperature heat-sealing machine. Typical bonding parameters are a temperature of 130°C–200°C, a duration of 3–5 seconds, and a pressure of 1.0–2.0 bar (approximately 1.02–2.04 kgf/cm²). [1] Specific heat-sealing parameters may require fine-tuning based on the adhesive formulation and product model.
