PCB hot-press kraft paper is a specialised kraft paper designed specifically for the PCB industry. Its key features include uniform heat transfer, high strength and excellent value for money. It is primarily used in electronic lamination, high-end packaging, and insulation and heat insulation applications.

Production Process
Manufactured on a fourdrinier machine using sulphate softwood pulp as the primary raw material: 1. Pulping: Softwood is digested using the sulphate process to produce long-fibre, high-toughness pulp, ensuring the paper's strength and heat resistance. 2. Beating and Formulation: Moderate beating is applied, with the addition of wet-strength agents and high-temperature-resistant fillers to enhance heat resistance and wet strength. 3. Forming and Drying: Formed on a fourdrinier machine, followed by pressing and drying (105–120°C) to control moisture content at 5%–8%.

Core Performance
High-Temperature Resistance: Withstands 160–190°C for extended periods and up to 210°C for short durations.
Uniform Heat Transfer: Stable thermal conductivity and minimal temperature variation ensure consistent temperatures across the pressing surface.
Cushioning: Equalises pressure to protect precision components. High strength: Longitudinal tensile strength ≥6.5 kN/m, transverse ≥4.0 kN/m; tear-resistant and durable. Good water absorption: Absorbs resin and moisture vapour released during lamination, preventing contamination and reducing defects. Electrical insulation: High dielectric strength, suitable for insulation applications such as transformers and cables. Smooth and clean: Free from creases, holes and impurities, ensuring the quality of the laminated surface.

Application Scenarios Electronics Industry (Core Application) PCB/FPC/CCL Laminating:
Placed between steel plates and board materials during multilayer lamination to provide cushioning, pressure equalisation, thermal insulation, moisture absorption and anti-adhesion, thereby improving lamination uniformity and yield rates. Copper-clad laminate production: Ensures uniform heat transfer and absorbs volatiles during high-temperature lamination, safeguarding substrate performance. Electronic Component Insulation: Used for insulation layers and protective packaging in transformers, motors and cables.