PCB Hot-press Interlayer Paper

Manufacturing process for PCB hot-press interlayer paper:

>High-strength plant fibres: Modified and specially pulped

>High-temperature-resistant fibres: Produced using our proprietary process to achieve superior heat resistance

>Paper formation: Manufactured on specialised paper machines;

>Slitting and packaging: Online removal of static electricity and dust, surface finishing and online quality inspection, moisture-proof and impact-resistant packaging;

PCB hot-press interlayer paper vs PCB hot-press kraft paper
PCB hot-press interlayer paper has been specifically developed and engineered as a cushioning material for the lamination process of copper-clad laminates (CCL) and printed circuit boards (PCB). Compared to traditional PCB hot-press kraft paper, it offers the following features:
➢ Manufactured using high-quality plant fibres, modified special fibres and a unique forming process;
➢ Provides stable, sustained cushioning pressure and excellent resilience. Resilience is significantly restored after leaving the material to rest for 12 hours prior to reuse;
➢ Heating rate is similar to that of kraft paper, ensuring uniform heat transfer;
➢ At an operating temperature of 210°C, 40 kg pressure and 180 minutes, it can be cycled and reused more than 10 times (subject to specific customer lamination conditions);
➢ At an operating temperature of 190°C or below, 30 kg pressure and 120 minutes, it can be cycled and reused more than 30 times (subject to specific customer lamination conditions);
➢ No shedding of fibres or dust occurs during the lamination process;
➢ No sticking to steel plates or between sheets during the pressing process. Please ensure proper moisture protection during use, otherwise anti-adhesion performance will be significantly reduced;
➢ Significantly reduces the overall cost per pressing cycle, improves production efficiency and reduces the workload of on-site personnel;
➢ Product grammages available: 160 g/m², 210 g/m² and 240 g/m²; customisable;